Automatic Dividing Device for Ceramic Substrates "Scriber"
Generate fine cracks with a diamond rotary cutter and split the substrate after firing.
The "Scriber" is a device that performs scribing processing on ceramic substrates after firing using a diamond cutter. It achieves high-speed (up to 500mm/sec) and high-precision (±30um) processing, allowing for the clean division of substrates without being affected by material loss or cutting fluid. 【Features】 ■ Generates fine cracks with a diamond rotary cutter to divide the substrate after sintering. ■ No cleaning process is required; division processing can be performed after component mounting. ■ Can be processed with high precision without being affected by shrinkage due to temperature changes during firing. *For more details, please refer to the PDF document or feel free to contact us.
- Company：ヤマハファインテック
- Price：Other
